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NUF6410MN
1
2
3
4
5
6
GND
12
11
10
9
8
7
(Bottom View)
Figure 3. Pin Diagram
Table 1. FUNCTIONAL PIN DESCRIPTION
Filter
Filter 1
Filter 2
Filter 3
Filter 4
Filter 5
Filter 6
Ground Pad
MAXIMUM RATINGS
Device Pins
1 & 12
2 & 11
3 & 10
4&9
5&8
6&7
GND
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
Filter + ESD Channel 5
Filter + ESD Channel 6
Ground
Description
Parameter
Symbol
Value
Unit
ESD Discharge IEC61000 ? 4 ? 2
Contact Discharge
V PP
8.0
kV
DC Power per Resistor
DC Power per Package
Operating Temperature Range
Storage Temperature Range
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
P R
P T
T OP
T STG
T L
100
600
? 40 to 85
? 55 to 150
260
mW
mW
° C
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Maximum Reverse Working Voltage
V RWM
5.0
V
Breakdown Voltage
V BR
I R = 1.0 mA
6.0
7.0
V
Leakage Current
I R
V RWM = 3.3 V
10
100
nA
Resistance
Diode Capacitance
Line Capacitance
3 dB Cut ? Off Frequency (Note 1)
6 dB Cut ? Off Frequency (Note 1)
R A
C d
C L
f 3dB
f 6dB
I R = 20 mA
V R = 2.5 V, f = 1.0 MHz
V R = 2.5 V, f = 1.0 MHz
Above this frequency,
appreciable attenuation occurs
Above this frequency,
appreciable attenuation occurs
85
100
7.0
14
250
400
115
9.0
18
W
pF
pF
MHz
MHz
1. 50 W source and 50 W load termination.
http://onsemi.com
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